Future Of Solder Materials Market With CAGR Growth Forecast Till 2025 | Grand View Research, Inc.



The global solder materials market size is anticipated to reach USD 1.41 billion by 2025 expanding at a CAGR of 3.4%, according to a new report by Grand View Research, Inc. Rising demand for advanced consumer electronics and resultant rise in gadget repair and refurbishing activities is expected to boost the demand for soldering processes. Introduction of lead-free solders due to stringent regulations against the lead toxicity is expected to propel the industry growth over the forecast period. Rising usage of new solid-state semiconductor technologies in consumer and industrial applications is also anticipated to support the market development.

The nano-paste and sub-micron particles are expected to gain traction due to characteristics, such as lower melting point temperatures, large surface energy, large surface area per unit volume, and super magnetism. The usage of low-cost, non-patented alloy formulations in place of patented products is predominant in the industry. However, the use of non-patented alloys may hamper the overall product quality, which is expected to have a negating impact on the industry growth in the years to come.
The solder materials market in U.S. is expected to be driven primarily by the growth of electronics refurbishing industry. In addition, rising production of electronic devices in the region coupled with the presence of a notable electronics aftermarket industry is expected to boost the demand for such materials over the forecast period. Extensive R&D towards the production of advanced solder materials, such as Sn-Bi-Ag alloy, by key companies has reduced thermal excursion during electronic assembly.
Browse Research Report On solder materials Market:
https://www.grandviewresearch.com/industry-analysis/solder-materials-market

Advancements in the soldering techniques through process automation is also expected to promote the market growth over the forecast period. Automation in the soldering process has helped reduce human intervention, which, in turn, is results in increased efficiency. As a result, the market is likely to register a notable growth in the years to come.

Further key findings from the study suggest:
·         The wire product segment is expected to witness the highest CAGR reaching at USD 544.6 million by 2025. This growth is attributed to high product demand in component miniaturization in electronic devices
·         Solder paste has also witnessed a significant growth owing to advancements in micron- and sub-micron particles
·         Usage of solder materials through robotic process generated a revenue of USD 321.5 million in 2017 as a result of increased automation across various industries, such as industrial manufacturing
·         The industry is highly competitive in nature and is driven by innovations and material and technological advancements
·         Prominent companies in the global solder materials market emphasize on the production of advanced materials to have a competitive edge over others
Wire emerged as the largest product segment in the past and is anticipated to reach at USD 554.6 million by 2025. Key factors driving the segment include wide usage of wires in PCB soldering and superior output. For instance, awareness regarding the use of specific wires for designated applications, such as acid core solder wire, which can be used in plumbing but cannot be used electronics, as it has acid constituent.

Introduction of advanced solder wires containing specialized flux leads and enhanced properties, such as mechanical strength and electrical contacts, is also boosting the segment growth. In addition, the demand for wires is expected to rise in the wake of increased use in the electronics industry.

Browse Press Release of this report:
https://www.grandviewresearch.com/press-release/global-solder-materials-market

Other type of products include paste, bar, and flux. Paste is a suspension formed with fine particles and is mainly used to solder Surface Mount Devices (SMD) through Surface Mount Technology (SMT) while manufacturing printed circuit boards. Paste precisely deposits the correct amount onto each of the pads to be soldered in printed circuit boards. It is also used on a large scale for electronic assembly of miniaturized components. Increasing manufacturing of electronic products and printed circuit boards is driving the product demand. Moreover, ease of application of paste onto the PCBs is expected to drive the segment further over the forecast period.

Grand View Research has segmented the global solder materials market on the basis of product, process:
Solder Materials Product Outlook (Revenue, USD Million, 2014 - 2025)
·         Wire
·         Paste
·         Bar
·         Flux
Solder Materials Process Outlook (Revenue, USD Million, 2014 - 2025)
·         Screen Printing
·         Robotic
·         Laser
·         Wave/Reflow
Key companies in the industry focus on developing technologically advanced materials through research initiatives. They also strive to deliver high-performance solder alloys and raw materials that provide advanced soldered bonds in lesser time.
Companies engaged in the supply of such products function through technological advancements and launch of innovative products, such as the SN100C (032) by Njhon Superior Co. Ltd., to achieve operational excellence. Majority of companies invest more in R&D, to achieve high durability outputs.

About Grand View Research
Grand View Research, Inc. is a U.S. based market research and consulting company, registered in the State of California and headquartered in San Francisco. The company provides syndicated research reports, customized research reports, and consulting services. To help clients make informed business decisions, we offer market intelligence studies ensuring relevant and fact-based research across a range of industries, from technology to chemicals, materials and healthcare.



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